FLP Wafer 1700 nano
New know-how – wafers on granite
FLP Microfinishing has developed its own CMP wafer polishing machine series for use in the semiconductor industry. The new FLP Wafer 1700 nano is a wafer double-sided polishing machine.
For the first time, chemically resistant granite polishing wheels are installed in this machine, which are continuously controlled via servo drives. They ensure a very high degree of accuracy of the tool finish.
In addition to silicon prime wafers, gallium arsenide, silicon carbide, sapphire and other substrates can also be processed.
